This invaluable textbook covers all the subject matter in a typical undergraduate course in engineering thermodynamics, and uses carefully chosen worked examples and problems to expose students to diverse applications of thermodynamics. This new edition has been revised and updated to include two new chapters on thermodynamic property relations, and the statistical interpretation of entropy.
Problems with numerical answers are included at the end of each chapter. As a guide, instructors can use the examples and problems in tutorials, quizzes and examinations. Request Inspection Copy. Agami Reddy T.
Agami Reddy. Author : T. Heating and Cooling of Buildings: Principles and Practice of Energy Efficient Design, Third Edition is structured to provide a rigorous and comprehensive technical foundation and coverage to all the various elements inherent in the design of energy efficient and green buildings.
Along with numerous new and revised examples, design case studies, and homework problems, the third edition includes the HCB software along with its extensive website material, which contains a wealth of data to support design analysis and planning. It serves as an up-to-date technical resource for future designers, practitioners, and researchers wishing to acquire a firm scientific foundation for improving the design and performance of buildings and the comfort of their occupants.
Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.
Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations provides a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging.
Each of the author-written volumes presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts.
This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering. Set 3 opens with Heat Transfer in Avionic Equipment, authored by Dr Boris Abramzon, offering a comprehensive, in-depth treatment of compact heat exchangers and cold plates for avionics cooling, as well as discussion on recent developments in these heat transfer units that are widely used in the thermal control of military and civilian airborne electronics.
The Set continues with Thermal Management of RF Systems, which addresses sequentially the history, present practice, and future thermal management strategies for electronically-steered RF systems, in the context of the RF operational requirements, as well as device-, module-, and system-level electronic, thermal, and mechanical considerations.
Their combined efforts have resulted in a text, which is well-grounded in the relevant past, present, and future RF systems and technologies. Thus, this volume will provide the designers of advanced radars and other electronic RF systems with the tools and the knowledge to address the thermal management challenges of today's technologies, as well as of advanced technologies, such as wide bandgap semiconductors, heterogeneously integrated devices, and 3D chipsets and stacks.
The third volume in Set 3, Phase Change Materials for Thermal Management of Electronic Components, co-authored by Prof Gennady Ziskind and Dr Yoram Kozak, provides a detailed description of the numerical methods used in PCM analysis and a detailed explanation of the processes that accompany and characterize solid-liquid phase-change in popular basic and advanced geometries.
These provide a foundation for an in-depth exploration of specific electronics thermal management applications of Phase Change Materials. This volume is anchored in the unique PCM knowledge and experience of the senior author and placed in the context of the extensive solid-liquid phase-change literature in such diverse fields as material science, mathematical modeling, experimental and numerical methods, and thermofluid science and engineering.
Dorf Richard C. Author : Richard C. First published in , The Engineering Handbook quickly became the definitive engineering reference. Although it remains a bestseller, the many advances realized in traditional engineering fields along with the emergence and rapid growth of fields such as biomedical engineering, computer engineering, and nanotechnology mean that the time has come to bring this standard-setting reference up to date.
New in the Second Edition 19 completely new chapters addressing important topics in bioinstrumentation, control systems, nanotechnology, image and signal processing, electronics, environmental systems, structural systems chapters fully revised and updated Expanded lists of engineering associations and societies The Engineering Handbook, Second Edition is designed to enlighten experts in areas outside their own specialties, to refresh the knowledge of mature practitioners, and to educate engineering novices.
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Customer satisfaction guaranteed! May contain light wear and markings. In stock. Usually ships within 4 to 5 days. Por favor esperar de 7 a 15 dias para la entrega. Duckworth, Henry E. Dissociative Disorders. Mood Disorders: Unipolar and Bipolar. Lynn P. Rehm, Alisha L. Wagner, Carolyn Ivens-Tyndal. Schizophrenia: Biopsychological Aspects.
Genetics and Schizophrenia. Schizophrenia: A Critical Examination. Antisocial Personality Disorder. Patricia B. Sutker, Albert N. Allain Jr. Borderline Personality Disorder: An Overview.
Henry E Adams, Jeffrey A. Bernat, Kristen A. Histrionic, Narcissistic, and Dependent Personality Disorders. Paranoid, Schizoid, and Schizotypal Personality Disorders. Michael B. Miller, J. David Useda, Timothy J. Trull, Rachel M.
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